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T200 4-Zone Reflow Oven

Compact 4-zone reflow soldering system designed for small to medium production batches. Perfect balance of performance and efficiency for prototype and low-volume manufacturing.

4-Zone Heating Compact Design Economical Lead-Free Ready

Key Features

  • 4-zone forced hot air convection heating system
  • Compact design ideal for limited workspace
  • Economical solution for low to medium volume production
  • Precise PID temperature control
  • Suitable for both leaded and lead-free soldering
  • User-friendly LCD display with profile management

Specifications

Heating Zones
4 Zones
Max Temperature
300°C
Conveyor Speed
50-1500mm/min
PCB Width
Max 200mm

Best For

  • Small-to-medium batch production
  • Prototype and low-volume manufacturing
  • Compact workshops with limited space
  • Both leaded and lead-free soldering

Not Ideal For

  • High-volume mass production (consider R612E/R816)
  • Complex thermal profiles requiring 6+ zones
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Ready to Get Your SMT Line Configuration?

Send us the following information, and we will recommend a suitable SMT line configuration for your specific production needs.

Information to Include in Your Inquiry:

PCB size — max dimensions you need to handle
BOM / component count — how many unique part types
Minimum package size — e.g., 0201, 0402, QFP, BGA
Feeder demand — estimated number of feeders needed
Monthly output — target PCBs per month
Application — LED, industrial control, medical, consumer, etc.
Available space — workshop dimensions
Target budget — approximate investment range
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